After the ZETA network is re-adjusted, it not only supports the typical star topology, but also supports Low Power Consumption Wide Area IoT Module to access through network element Mote. A tree-like multi-hop topology called "Mesh Access" is formed between the Motes, and the Mote is then connected to the AP. Compared with other LPWAN solutions, this networking method has the following advantages: • In the signal blind area that cannot be covered by the AP, it can be easily covered by network element Mote. • Network element Mote can extend the signal reach when only a few terminal devices need to connect to the network at a long distance. • All traffic connected to the AP is shunted, reducing the probability of collisions and increasing network capacity. • Network element Mote is a low-power device like the terminal, with a battery life of 3-5 years. Star topology The Mesh Access layer is optional. When the communication environment is good or the communication distance requirement is low, After removing the Mesh Access layer, the wireless network becomes a star topology. Single-hop mesh topology When the communication environment is not ideal, network element Mote needs to be supplemented at a suitable location to realize communication, forming a single-hop mesh topology. Multi-hop mesh topology A multi-hop connection can be formed between Motes to cope with a harsher communication environment or to achieve longer-distance communication, forming a multi-hop topology. Air interface resources are limited. Regardless of the communication protocol, it needs to balance bandwidth, speed, power consumption, channel utilization, data delay, capacity, cost, etc. Different scenarios require different communication protocols. Currently, four sets of protocols are introduced , Basically covering the typical vertical application scenarios of low-power wide-area IoT. P protocols: Low latency and low business traffic, mainly for local area networking. G protocols: Periodic report, no down, suitable for asset tracking, warehouse inventory. S protocols: Time-frequency resource multiplexing is adopted to reduce the probability of conflicts. It is suitable for large business traffic and is mainly for metropolitan area networking. Lite protocols: Designed specifically for lighting Internet of Things, with low latency from downstream to network element mote, including features such as inspection, heterogeneous networking, and asymmetric upstream and downstream.

A few days ago, Apple introduced the new wireless over-ear headphones AirPods Max. This headset with high-fidelity audio, adaptive equalizer, active noise reduction and spatial audio is priced at US$549 in the United States and 4399 yuan in China. Orders are now available on Apple's official website and Apple Store applications, and shipments will begin on December 15. It just caters to the Christmas holiday. In terms of color matching, AirPods Max offers five colors of space gray, silver, sky blue, green and pink. Pink is simply a Christmas gift harvester. The black technology of AirPods Max Apple's official information. This headset uses a "breathable knitted mesh" that spans the stainless steel headband to distribute weight and reduce overhead pressure. Acoustic engineering memory foam is used on the earmuffs. In terms of core sound quality, AirPods Max uses Apple’s self-designed 40mm dynamic driver. According to Apple, this unit can provide "rich, deep bass, accurate midrange, and clear and clean high frequency extension." This headset is characterized by Apple's H1 chip and computing audio. Each earmuff has three outward microphones to detect environmental noise, and a microphone in the earmuff can monitor the sound reaching the listener's ears. Then the data collected by these microphones is sent to the H1 chip for calculation, so as to achieve the effect of reducing noise. The H1 chip also provides an adaptive equalizer, active noise reduction, transparent mode and spatial audio for the headset. Using the gyroscope and accelerometer in AirPods Max and iPhone or iPad, H1 can track the movement of the user's head and the device, compare the movement data, and then remap the sound field to fix it on the device to ensure the user's sound field is consistent. In terms of calls, Apple designed beamforming microphones for AirPods Max’s Siri and voice calls, which can block ambient noise and focus on the user’s voice to improve clarity. AirPods Max also has built-in optical and position sensors, which can automatically detect when the headset is worn on someone's head. Once put on, AirPods Max will play audio, once removed, or when the user lifts an earmuff, the playback can be paused. It should be said that the functions provided by Apple's AirPods Max are unmatched by other HIFI headsets. Is AirPods Max worth it? Judging from the current news, AirPods Max is likely to be Goertek's foundry or provide the core audio technology. Compared with traditional HIFI headset manufacturers, the accumulation of audio may be insufficient. But this product itself is revolutionary. In terms of audio, digital and technology can do many things. A long, long time ago, there were digital calculations for various sound effects, but these things were on computers. Later, on the mobile phone, the chip is now powerful enough to be calculated on the headset. And now the sensors are cheap, and Apple uses enough microphones to collect data and realize calculations. This a...

Artificial intelligence (AI) chips are the key infrastructure supporting the development of artificial intelligence technology and industry, and have an important strategic position. At present, artificial intelligence technology and industry continue to develop at a high speed, and a technology industry ecology consisting of chips, data, development frameworks, algorithms, and applications has basically formed. The scale of the artificial intelligence chip industry is growing rapidly. The wave of artificial intelligence development has given birth to new growth points in the chip market. The artificial intelligence chip market maintains strong growth capabilities. According to IDC data, the global overall AI chip market reached US$4 billion in 2017. By 2022, the overall AI chip market size will be Reached 35.2 billion U.S. dollars, and the CAGR was greater than 55%. China’s artificial intelligence chip market is also developing well. According to the “China Artificial Intelligence Chip Industry Development White Paper” released by the research data agency CCID Consulting at the 2019 World Artificial Intelligence Conference, China’s AI chip market continued to maintain rapid growth in 2018. The market scale reached 8.008 billion yuan, a year-on-year increase of 50.2%. Affected by many favorable factors such as the macro policy environment, technological progress and upgrading, and the popularization of artificial intelligence applications, China's AI chip market will further mature. It is estimated that in the next 5 years, the scale of China's chip market will maintain a growth rate of 40%-50%. In 2024, the market will reach 78.5 billion. At present, artificial intelligence chip products mainly cover three areas: cloud training, cloud reasoning, and terminal reasoning. In the field of cloud training, model training needs to achieve high-performance, high-precision, and general computing capabilities. Nvidia has an absolute advantage in the cloud training market with its GPU industry ecology. Google and Intel develop ASIC chips to challenge; In the field of cloud reasoning, energy-efficient GPUs, FPGAs, and ASICs have become the layout schemes of various enterprises. Google, Intel, Xilinx and other manufacturers have laid out their plans, and the future market structure is undecided; In the field of terminal reasoning, chips need to meet the needs of differentiated scenarios such as low latency or low power consumption. There are many market segments. ASIC chips have gradually become the mainstream path. Image recognition and speech recognition are key application areas. Participants include not only Qualcomm, Intel , NVIDIA and other traditional chip giants, as well as new entrants such as Google, HiSilicon, Cambrian, and Horizon. AI chip application innovation is active, and a wider range of applications have been achieved in cloud computing, autonomous driving, smart security, smart phones and other fields, and the future market prospects are ...

On August 1, 2020, a scientific and technological achievement appraisal meeting organized by Shenzhen Expert Hi-tech Technology Co., Ltd. was held in Shenzhen Bomin Electronics Co., Ltd. After questioning and discussion, the appraisal committee agreed that: Bomin Electronics"5G base station antenna integrated coupling printed board key The projects of "Technology and Products" and "Key Technologies and Products of Secondary Power Supply Printed Boards for 5G Communication Base Stations" are domestically advanced and agreed to pass the appraisal of scientific and technological achievements. Key technologies and products of 5G base station antenna integrated coupling printed board The technical field of the project and the technical problem to be solved This project belongs to the research and development of high-frequency printed board technology in the field of communication base stations. The most common and difficult problem in the 5G base station antenna calibration network is the difference in amplitude and phase consistency, which leads to problems such as difficulty in debugging and failure of signal detection. The technical solution adopted by the project to solve technical problems The coupling printed board of the 5G base station antenna calibration network, through DOE experimental design and simulation analysis, obtains the main influencing factors such as line length, coupling distance, and dielectric thickness that affect the phase and coupling degree. The main influencing factors are verified and specified Typesetting and pressing programs, dynamic etching compensation, vacuum etching, intelligent expansion and contraction control, etc., solve the problem of the consistency of amplitude and phase, and achieve a 64-port coupling degree of ±0.8dB, amplitude tolerance ≦ 0.6dB, phase tolerance ≦ 6° Goal, and systematically studied the effects of patch/surface roughness/materials on the amplitude and phase, and designed an integrated coupling board to achieve the effect of integrated, low-cost, lightweight calibration network in terms of cost saving. Key technologies and products of secondary power supply printed boards for 5G communication base stations The technical field of the project and the technical problem to be solved This project belongs to the research and development of high-multilayer thick copper coil plate technology in the field of base station power supply. Technical problems in the project: alignment and lamination of 14-layer high multilayer boards with a thin core board of 0.11mm and a copper thickness of 4OZ; the production of blind holes with a depth of 0.18mm; local metallization of holes and slots; coil detection methods; Process problems such as the production process of ultra-thick hole copper over 50 microns. The technical solution adopted by the project to solve technical problems The project adopts high-multilayer thick copper thin core board alignment and pressing technology, including the use of Pin needle ...

Shenzhen announces full coverage of 5G independent networking On August 17, at the press conference of "Lighting Up Shenzhen, the City of 5G Wisdom", Shenzhen Mayor Chen Rugui announced that Shenzhen had overfulfilled the goal of "building 45,000 5G base stations" ahead of schedule, becoming the first in the country to achieve Cities with full coverage of 5G independent networking are the first to enter the 5G era. It is understood that as of August 14, Shenzhen has built 46,480 5G base stations, and Shenzhen's 5G industry scale, 5G base station and terminal shipments rank first in the world. Chen Rugui said that in the future, Shenzhen will vigorously implement the "5G+" action, give full play to the innovative first-mover advantages of 5G backbone companies such as Huawei, ZTE, Tencent and the three major operators, and launch more 5G application scenarios, innovative formats and demonstration projects, and strive to build Global 5G benchmark cities. On the same day, Huawei’s rotating chairman Guo Ping said at the press conference that 92 operators around the world are currently working together to deploy 5G commercial networks, with more than 100 million 5G users, and global 5G deployment will come to an end. In the next stage, the world will focus on the development of 5G industry applications and release 5G dividends. Shenzhen becomes the world's first 5G city 5G technology is the core technology of the new round of technological revolution and industrial transformation. The 5G industry is one of the most promising industries in the future. 5G networks are the most important new infrastructure. 5G will accelerate the promotion of the interconnection of everything, the perception of everything, and everything intelligent. People are full of beautiful expectations for the changes in production and lifestyles and the innovation of social governance models brought about by 5G independent networking. At present, Shenzhen is the world leader in the total number of 5G standard essential patents, and the scale of the 5G industry and the shipments of 5G base stations and terminals are ranked first in the world. According to Jia Xingdong, Director of the Shenzhen Municipal Bureau of Industry and Information Technology, Shenzhen selected ten fields such as medical care, transportation, security, and police to carry out typical applications, and selected ten industry fields such as ultra-high-definition video and industrial Internet to carry out typical applications. The application demonstration effect is remarkable. Build Shenzhen into a global digital economy model Guo Ping pointed out that the current global 5G deployment will come to an end, and the focus of the next phase is to develop industry applications, release 5G dividends, and achieve 5G commercial success; the 3GPP R16 standard is officially frozen, which will further promote the development of 5G industry applications. "The commercial success of 5G is through the integration of connectivi...

The popularity of automotive electronics will promote the increase in volume and price of automotive PCBs (printed circuit boards). In recent years, the electrification and electronization of automobiles have become obvious, and PCBs are almost ubiquitous in automobile electronic systems. New energy vehicles and smart driving components will greatly increase the value of automotive PCBs In recent years, the trend of electrification and electronization of automobiles has become more and more obvious. As the backbone of electronic products, PCB manufacturing has become increasingly important in the automotive supply chain. Compared with traditional fuel vehicles, the addition of charging, energy storage, power distribution and voltage conversion equipment for new energy vehicles will bring a large number of new application scenarios to PCBs. At the same time, although autonomous driving above L4 cannot be mass-produced in a short time, the gradual penetration of a variety of intelligent driving components will bring rapid development opportunities for the application of high-end high-frequency PCBs in automobiles. Big PCB application: New Energy Vehicles According to our calculations, in the powertrain and transmission fields alone, the bicycle value of PCBs on electric vehicles is as high as about RMB 800, which is 20 times the value of PCBs in this field of traditional vehicles. The new demand for electric vehicles mainly comes from powertrain related equipment-on-board chargers, battery management systems (BMS), voltage conversion systems (DC-DC, inverters, etc.) and other high-voltage and low-voltage devices. A large number of high-voltage and high-power devices contained in new energy vehicles, such as IGBTs and MOSFETs, have high requirements for heat dissipation, which makes the layout of PCBs not too dense and further increases the amount of PCBs for new energy vehicles. On each new energy vehicle, the total PCB board required for the above-mentioned equipment alone amounts to about 0.8 square meters. However, the total PCB required for a medium-level electronic fuel vehicle is only about 0.43 square meters. In the internal combustion engine and traditional system of traditional fuel vehicles, the amount of PCB is very small, only about 0.04 square meters in total. Automotive millimeter wave radar is an important promoter of high-end PCB promotion Among smart driving devices, millimeter wave radar must be manufactured with high frequency PCB. The unit price of high-frequency PCB is several times that of ordinary PCB, and the value of PCB for bicycle millimeter wave radar can reach 100 yuan. Automotive millimeter-wave radars mainly use two frequency bands, 24GHz and 77~79GHz, and the frequency is much higher than the usage scenarios of general circuits. The characteristics of high-frequency circuits determine that the key raw materials of high-frequency PCBs-copper clad laminates to PCB manufacturing links are much higher than ordinary PCBs:...