Artificial intelligence (AI) chips are the key infrastructure supporting the development of artificial intelligence technology and industry, and have an important strategic position. At present, artificial intelligence technology and industry continue to develop at a high speed, and a technology industry ecology consisting of chips, data, development frameworks, algorithms, and applications has basically formed. The scale of the artificial intelligence chip industry is growing rapidly. The wave of artificial intelligence development has given birth to new growth points in the chip market. The artificial intelligence chip market maintains strong growth capabilities. According to IDC data, the global overall AI chip market reached US$4 billion in 2017. By 2022, the overall AI chip market size will be Reached 35.2 billion U.S. dollars, and the CAGR was greater than 55%. China’s artificial intelligence chip market is also developing well. According to the “China Artificial Intelligence Chip Industry Development White Paper” released by the research data agency CCID Consulting at the 2019 World Artificial Intelligence Conference, China’s AI chip market continued to maintain rapid growth in 2018. The market scale reached 8.008 billion yuan, a year-on-year increase of 50.2%. Affected by many favorable factors such as the macro policy environment, technological progress and upgrading, and the popularization of artificial intelligence applications, China's AI chip market will further mature. It is estimated that in the next 5 years, the scale of China's chip market will maintain a growth rate of 40%-50%. In 2024, the market will reach 78.5 billion. At present, artificial intelligence chip products mainly cover three areas: cloud training, cloud reasoning, and terminal reasoning. In the field of cloud training, model training needs to achieve high-performance, high-precision, and general computing capabilities. Nvidia has an absolute advantage in the cloud training market with its GPU industry ecology. Google and Intel develop ASIC chips to challenge; In the field of cloud reasoning, energy-efficient GPUs, FPGAs, and ASICs have become the layout schemes of various enterprises. Google, Intel, Xilinx and other manufacturers have laid out their plans, and the future market structure is undecided; In the field of terminal reasoning, chips need to meet the needs of differentiated scenarios such as low latency or low power consumption. There are many market segments. ASIC chips have gradually become the mainstream path. Image recognition and speech recognition are key application areas. Participants include not only Qualcomm, Intel , NVIDIA and other traditional chip giants, as well as new entrants such as Google, HiSilicon, Cambrian, and Horizon. AI chip application innovation is active, and a wider range of applications have been achieved in cloud computing, autonomous driving, smart security, smart phones and other fields, and the future market prospects are ...

On August 1, 2020, a scientific and technological achievement appraisal meeting organized by Shenzhen Expert Hi-tech Technology Co., Ltd. was held in Shenzhen Bomin Electronics Co., Ltd. After questioning and discussion, the appraisal committee agreed that: Bomin Electronics"5G base station antenna integrated coupling printed board key The projects of "Technology and Products" and "Key Technologies and Products of Secondary Power Supply Printed Boards for 5G Communication Base Stations" are domestically advanced and agreed to pass the appraisal of scientific and technological achievements. Key technologies and products of 5G base station antenna integrated coupling printed board The technical field of the project and the technical problem to be solved This project belongs to the research and development of high-frequency printed board technology in the field of communication base stations. The most common and difficult problem in the 5G base station antenna calibration network is the difference in amplitude and phase consistency, which leads to problems such as difficulty in debugging and failure of signal detection. The technical solution adopted by the project to solve technical problems The coupling printed board of the 5G base station antenna calibration network, through DOE experimental design and simulation analysis, obtains the main influencing factors such as line length, coupling distance, and dielectric thickness that affect the phase and coupling degree. The main influencing factors are verified and specified Typesetting and pressing programs, dynamic etching compensation, vacuum etching, intelligent expansion and contraction control, etc., solve the problem of the consistency of amplitude and phase, and achieve a 64-port coupling degree of ±0.8dB, amplitude tolerance ≦ 0.6dB, phase tolerance ≦ 6° Goal, and systematically studied the effects of patch/surface roughness/materials on the amplitude and phase, and designed an integrated coupling board to achieve the effect of integrated, low-cost, lightweight calibration network in terms of cost saving. Key technologies and products of secondary power supply printed boards for 5G communication base stations The technical field of the project and the technical problem to be solved This project belongs to the research and development of high-multilayer thick copper coil plate technology in the field of base station power supply. Technical problems in the project: alignment and lamination of 14-layer high multilayer boards with a thin core board of 0.11mm and a copper thickness of 4OZ; the production of blind holes with a depth of 0.18mm; local metallization of holes and slots; coil detection methods; Process problems such as the production process of ultra-thick hole copper over 50 microns. The technical solution adopted by the project to solve technical problems The project adopts high-multilayer thick copper thin core board alignment and pressing technology, including the use of Pin needle ...

Shenzhen announces full coverage of 5G independent networking On August 17, at the press conference of "Lighting Up Shenzhen, the City of 5G Wisdom", Shenzhen Mayor Chen Rugui announced that Shenzhen had overfulfilled the goal of "building 45,000 5G base stations" ahead of schedule, becoming the first in the country to achieve Cities with full coverage of 5G independent networking are the first to enter the 5G era. It is understood that as of August 14, Shenzhen has built 46,480 5G base stations, and Shenzhen's 5G industry scale, 5G base station and terminal shipments rank first in the world. Chen Rugui said that in the future, Shenzhen will vigorously implement the "5G+" action, give full play to the innovative first-mover advantages of 5G backbone companies such as Huawei, ZTE, Tencent and the three major operators, and launch more 5G application scenarios, innovative formats and demonstration projects, and strive to build Global 5G benchmark cities. On the same day, Huawei’s rotating chairman Guo Ping said at the press conference that 92 operators around the world are currently working together to deploy 5G commercial networks, with more than 100 million 5G users, and global 5G deployment will come to an end. In the next stage, the world will focus on the development of 5G industry applications and release 5G dividends. Shenzhen becomes the world's first 5G city 5G technology is the core technology of the new round of technological revolution and industrial transformation. The 5G industry is one of the most promising industries in the future. 5G networks are the most important new infrastructure. 5G will accelerate the promotion of the interconnection of everything, the perception of everything, and everything intelligent. People are full of beautiful expectations for the changes in production and lifestyles and the innovation of social governance models brought about by 5G independent networking. At present, Shenzhen is the world leader in the total number of 5G standard essential patents, and the scale of the 5G industry and the shipments of 5G base stations and terminals are ranked first in the world. According to Jia Xingdong, Director of the Shenzhen Municipal Bureau of Industry and Information Technology, Shenzhen selected ten fields such as medical care, transportation, security, and police to carry out typical applications, and selected ten industry fields such as ultra-high-definition video and industrial Internet to carry out typical applications. The application demonstration effect is remarkable. Build Shenzhen into a global digital economy model Guo Ping pointed out that the current global 5G deployment will come to an end, and the focus of the next phase is to develop industry applications, release 5G dividends, and achieve 5G commercial success; the 3GPP R16 standard is officially frozen, which will further promote the development of 5G industry applications. "The commercial success of 5G is through the integration of connectivi...

The popularity of automotive electronics will promote the increase in volume and price of automotive PCBs (printed circuit boards). In recent years, the electrification and electronization of automobiles have become obvious, and PCBs are almost ubiquitous in automobile electronic systems. New energy vehicles and smart driving components will greatly increase the value of automotive PCBs In recent years, the trend of electrification and electronization of automobiles has become more and more obvious. As the backbone of electronic products, PCB manufacturing has become increasingly important in the automotive supply chain. Compared with traditional fuel vehicles, the addition of charging, energy storage, power distribution and voltage conversion equipment for new energy vehicles will bring a large number of new application scenarios to PCBs. At the same time, although autonomous driving above L4 cannot be mass-produced in a short time, the gradual penetration of a variety of intelligent driving components will bring rapid development opportunities for the application of high-end high-frequency PCBs in automobiles. Big PCB application: New Energy Vehicles According to our calculations, in the powertrain and transmission fields alone, the bicycle value of PCBs on electric vehicles is as high as about RMB 800, which is 20 times the value of PCBs in this field of traditional vehicles. The new demand for electric vehicles mainly comes from powertrain related equipment-on-board chargers, battery management systems (BMS), voltage conversion systems (DC-DC, inverters, etc.) and other high-voltage and low-voltage devices. A large number of high-voltage and high-power devices contained in new energy vehicles, such as IGBTs and MOSFETs, have high requirements for heat dissipation, which makes the layout of PCBs not too dense and further increases the amount of PCBs for new energy vehicles. On each new energy vehicle, the total PCB board required for the above-mentioned equipment alone amounts to about 0.8 square meters. However, the total PCB required for a medium-level electronic fuel vehicle is only about 0.43 square meters. In the internal combustion engine and traditional system of traditional fuel vehicles, the amount of PCB is very small, only about 0.04 square meters in total. Automotive millimeter wave radar is an important promoter of high-end PCB promotion Among smart driving devices, millimeter wave radar must be manufactured with high frequency PCB. The unit price of high-frequency PCB is several times that of ordinary PCB, and the value of PCB for bicycle millimeter wave radar can reach 100 yuan. Automotive millimeter-wave radars mainly use two frequency bands, 24GHz and 77~79GHz, and the frequency is much higher than the usage scenarios of general circuits. The characteristics of high-frequency circuits determine that the key raw materials of high-frequency PCBs-copper clad laminates to PCB manufacturing links are much higher than ordinary PCBs:...

Cutting-edge technologies such as speech recognition, voiceprint recognition, natural language processing, and deep learning have been maturely applied to smart electroacoustic products, forming reliable and sensitive commercial smart electroacoustic products. With the further application of machine learning and other technologies in the field of intelligent electroacoustics, which use data on a large scale to generate models that can understand speech and natural language, future intelligent electroacoustic products can further improve the accuracy of speech recognition and semantic understanding. It will play a more important role in the artificial intelligence industry. Electroacoustic product classification Electroacoustic products use electromagnetic induction, electrostatic induction or voltage effects to complete the conversion of electronic signals and sound signals. The main product categories include speakers, headphones, microphones, etc. Electroacoustic products mainly include electroacoustic components and terminal electroacoustic products. Global speaker market: strong demand for smart speakers According to Statista statistics, in 2019, the global speaker market scale was 28.589 billion U.S. dollars, of which the stereo speaker market was 20.981 billion U.S. dollars, and the smart speaker market was 7.608 billion U.S. dollars. It is predicted that by 2023, the global speaker market will reach USD 43.437 billion. According to statistics from Strategy Analytics, global smart speaker shipments reached 147 million units in 2019, a year-on-year increase of 69.83%. Strong holiday sales in the United States and Europe, as well as the recovery of Google's smart speaker business after new product launches, improved parts supply, and strong promotional activities have driven the growth of global smart speaker quarterly sales. Global headphone market: TWS headphone shipments are rising rapidly In recent years, with the increasing integration of consumer electronics, smart phones have gradually eliminated the earphone jack, and the global demand for TWS earphones has increased rapidly. According to Counterpoint data, the global TWS shipments of true wireless headsets in 2016 were only 9.18 million units, which climbed to 120 million units in 2019, with a compound annual growth rate of 161%. With the continuous optimization of TWS headset functions and increased consumer demand for portable headsets, Counterpoint predicts that global TWS shipments in 2020 are expected to increase by 92% year-on-year to 230 million units. Global microphone market: rapid growth in MEMS microphone shipments The miniature microphones currently used in the market mainly include electret condenser (ECM) microphones and microelectromechanical (MEMS) microphones. Compared with ECM microphones, MEMS microphones have many advantages. First, MEMS supports STM assembly and has higher production efficiency. Second, its package size is about twice as small as ECM. In addition...

With the advent of the 5G era, micro-innovation of automotive electronics, consumer electronics, and upgrading of communication equipment, the PCB industry will maintain a boom in the next few years. According to Prismark's forecast, the global market will reach USD 71.761 billion in 2022. China's share of the total output value of the global PCB industry has risen from 31.18% in 2008 to 53% in 2018, with a market size of more than 32 billion U.S. dollars, becoming the largest country in the global PCB output value. According to relevant data, the global communication PCB market reached US$19.06 billion in 2018, accounting for about 30% of the total PCB output value. In recent years, the global base station PCB market space in the 4G era is about 5-9 billion yuan, accounting for communication PCBs. The ratio is about 5-10%. With the advent of 5G, the PCB industry has ushered in another opportunity for leapfrog development. 5G's full-spectrum intervention, large-scale antenna array (MIMO) and ultra-dense networks will be the core technologies to realize 5G networks. These technologies also put forward new requirements and challenges for PCBs. First of all, the structure and function of the base station radio unit and antenna have undergone major changes, which are mainly manifested in the increase in the number of radio unit channels (8 channels increased to 64 channels), and the corresponding PCB area has increased; in addition, the RRU of 4G base stations has increased The structure of the antenna has evolved into the AAU structure of the 5G base station (RRU+antenna integration), and the corresponding PCB integration requirements are higher; again, in order to achieve ultra-dense network coverage, in addition to the spectrum application below 6GHZ, the 5G spectrum is used for hot spot coverage and The high-capacity and high-speed transmission 28G, 39G and other millimeter wave spectrum resources will be used in large quantities. Therefore, the core equipment, transmission equipment, and antenna/radio frequency equipment of the 5G network put forward very high demand for high-frequency and high-speed boards. According to related calculations, a single 5G base station uses about 3.21 square meters of PCB, which is 1.76 times the consumption of 4G base stations (1.825 square meters). At the same time, because the frequency of 5G communication is higher, the demand for PCB performance is greater, so 5G base stations use The unit price of PCB is higher than that of PCB for 4G base station. Taken together, the value of PCB for a single base station in the 5G era is about three times that of the 4G era. In addition, due to the higher frequency spectrum of 5G, the coverage area of base stations is smaller. According to estimates, 5G base stations will be 1.2-1.5 times that of 4G base stations. At the same time, more small base stations are required. Therefore, the total base station brought by 5G The number will be much more than 4G. It is estimated th...