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Two Scientific And Technological Achievements Have Passed The Appraisal And Technological Innovation Has Yielded Great Results
Aug 31, 2020

On August 1, 2020, a scientific and technological achievement appraisal meeting organized by Shenzhen Expert Hi-tech Technology Co., Ltd. was held in Shenzhen Bomin Electronics Co., Ltd. After questioning and discussion, the appraisal committee agreed that:

Bomin Electronics"5G base station antenna integrated coupling printed board key The projects of "Technology and Products" and "Key Technologies and Products of Secondary Power Supply Printed Boards for 5G Communication Base Stations" are domestically advanced and agreed to pass the appraisal of scientific and technological achievements.



5G High Multilayer Thin Core Board


Key technologies and products of 5G base station antenna integrated coupling printed board

The technical field of the project and the technical problem to be solved

This project belongs to the research and development of high-frequency printed board technology in the field of communication base stations. The most common and difficult problem in the 5G base station antenna calibration network is the difference in amplitude and phase consistency, which leads to problems such as difficulty in debugging and failure of signal detection.


5G Antenna Integrated Coupling Printed Board


The technical solution adopted by the project to solve technical problems

The coupling printed board of the 5G base station antenna calibration network, through DOE experimental design and simulation analysis, obtains the main influencing factors such as line length, coupling distance, and dielectric thickness that affect the phase and coupling degree. The main influencing factors are verified and specified Typesetting and pressing programs, dynamic etching compensation, vacuum etching, intelligent expansion and contraction control, etc., solve the problem of the consistency of amplitude and phase, and achieve a 64-port coupling degree of ±0.8dB, amplitude tolerance ≦ 0.6dB, phase tolerance ≦ 6° Goal, and systematically studied the effects of patch/surface roughness/materials on the amplitude and phase, and designed an integrated coupling board to achieve the effect of integrated, low-cost, lightweight calibration network in terms of cost saving.


5G Communication Base Stations Printed Boards


Key technologies and products of secondary power supply printed boards for 5G communication base stations

The technical field of the project and the technical problem to be solved

This project belongs to the research and development of high-multilayer thick copper coil plate technology in the field of base station power supply. Technical problems in the project: alignment and lamination of 14-layer high multilayer boards with a thin core board of 0.11mm and a copper thickness of 4OZ; the production of blind holes with a depth of 0.18mm; local metallization of holes and slots; coil detection methods; Process problems such as the production process of ultra-thick hole copper over 50 microns.

High Multilayer Thick Copper Coil Board

The technical solution adopted by the project to solve technical problems

The project adopts high-multilayer thick copper thin core board alignment and pressing technology, including the use of Pin needle electromagnetic hot melt, high-precision positioning drill PP, design solid target ring, copper paving technology, etc.; LDD laser blind hole vacuum resin The plug hole technology completes the deep blind hole production, and the design reaming local metallization process includes POFV and then reaming. The data of one reaming and the size of the reaming position of the metallization are consistent with the requirements of the finished product, while the non-metallization position is smaller than the required expansion. Hole position, add lead holes after pattern plating, and then do secondary electric milling; design circuit Kebang and forming Kebang detection and alignment accuracy technology, inductance detection technology to monitor secondary power supply coils, and achieve ultra-thick holes with local plating Copper production to achieve secondary power supply, high multilayer thick copper power coil board production.


5G Base Station Antenna Printed Board

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